Basic HTML Version
Course
Pro-forma
Bachelor of Engineering (Materials)
Code
KMEB4352
Title
Materials and Processes in Semiconductor Manufacturing
Pre-requisite
None
Student Learning Time (SLT)
120 hours
Credit
3
Learning Outcomes
1.
Explain the principles of different processes used in
semiconductor manufacturing.
2.
Select suitable processes and materials in different stages of
in IC manufacturing.
3.
Discuss important types of electronic packages, key
processes and materials involved in their manufacture.
Synopsis
Introduction to semiconductor industry and its importance in
global and Malaysian economy. Overview of semiconductor
devices and overall semiconductor manufacturing processes.
Crystal growth processes and wafer preparation, lithographic
techniques and materials, oxidation and thermal processes, ion
implantation, wet and plasma etching, thin film deposition and
metallization, chemical mechanical polishing. Testing and
packaging. Clean room basics and protocol.
Assessment
60 % Continuous Assessments
40 % Final Examination
References
1.
Semiconductor Manufacturing Technology, Michael Quirk
and Julian Serda, Prentice Hall, 2000.
2.
Fundamentals of Semiconductor Manufacturing and Process
Control, Gary S. May and Costas J. Spanos, Wiley-IEEE Press,
2006.
3.
Introduction to Semiconductor Manufacturing Technology,
Hong Xiao, Prentice Hall, International Edition, 2001.
4.
VLSI Technology (Principles and Applications in Engineering),
Wai-Kai Chen, CRC, 20
5.
Rao Tummala, Fundamentals of Microsystems Packaging,
McGraw-Hill Professional (Latest edition)
Soft Skills
•
Communication Skills
•
Critical Thinking
•
Team Work Skills
•
Life Long Learning